wafer dicing
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Valley Design Corp.
Lapping, optical polishing and dicing services
Polishing, lapping, dicing, backgrinding are some of the capabilities of the world
backgrinding, ceramics dicing, ceramics thinning, cmp, cmp polishing, dicing, edge polishing, lapping, lapping substrates, optical polishing, polished substrates, polishing, wafer dicing
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Westwind Air Bearings, Inc.
Air Bearings - Westwind Air Bearing Spindles
Westwind air bearings: air bearing spindles for PCB manufacturing, PCB drilling, automotive coating, semiconductor manufacturing equipment and wherever high rotational speed performance and very long life consistent performance needs are beyond the capabilities of conventional bearing technology. Bespoke solutions for semiconductor manufacturing equipment, scanning, coatings and HDD writing.
air bearing, air bearing spindle, air bearing spindles, air bearings, air bearings spindles, air bearings uk, custom spindles, electrostatic coating, electrostatic paint spraying, high speed spindle, ion implantation, laser scanning, linear slides, micro machining, monogon scanners, pcb drilling, pcb drilling spindle, pcb routing, pcb spindle, pcb spindles, polygon scanners, rotary spray coating, semiconductor equipment, spindle repair, spindle service, wafer dicing, wafer grinding, westwind, westwind air bearings, westwind bearings, westwind collets, westwind repair centres, westwind service centres, westwind spares, westwind spindle, westwind uk
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Wadsworth-pacific
Wadsworth-Pacific Home Page
Wadsworth-Pacific is a pioneer representative firm specializing in leading-edge materials for semiconductor fab, assembly and packaging. LTCC, stamped and etched leadframes, BGA heat spreaders and stiffeners, plastic shipping rails and leadframe packaging, UV dicing and backgrinding tape, diamond backgrinding wheels
alivh, altic, any layer invisible via hole, atlantic diamond, back end, backend, backgrinding, bga, bga stiffeners, chip scale packaging, copper leadframes, csp, diamond backgrinding wheels, diamond wheels, dicing wheels, dual gauge, etched leadframes, final manufacturing, furukawa, heatspreaders, hirai seimitsu, interleafs, interleaves, laminates, lead frame, leadframe boxes, leadframes, low temperature co-fired ceramic, ltcc, mask cases, micro-vias, microvias, pbga, pdi, plastic development, semi, semiconductor assembly, semiconductor backend, semiconductor packaging, semiconductor packaging and assembly, shipping rails, sip, system in package, tape and reel, thermal packaging, thinning, to-220, tubes, uv tape, via hole, vinyl packaging, wafer dicing, wafer scale, wafer thinning
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Dynatex International
Dynatex International - Semiconductor Dicing Equipment and Materials
Dynatex International manufactures semiconductor dicing equipment and materials
adhesive film, adhesives, backend, bar, blades, break, california, carriers, cleave, coolant, diamond, dicing, dicing blades, die, diode, dry process, dynatex international, equipment, fab, film, frames, hoops, kerfaid, laser, lubricant, manufacturing, materials, mylar, overlays, precision, saw, scribe, scribing, semiconductor, seperation, silicon valley, thin, wafer, wafer dicing, wafergrip
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Mcgrath, E., Inc.
Used High Vacuum, Semiconductor, Scientific Equipment, Optical Machinery, Ovens & Microscopes
Specializing in reconditioned high vacuum, optical machinery, reconditioned electric ovens, semiconductor manufacturing, microscopes, environmental chambers, vacuum furnaces, metalurgical equipment.
abar, air products prism, airco, alcatel, american optical, ami, artos, b&l, balzers pfeiffer, bausch & lomb, blue m, boc, bothner, brew, brooks automation, buehler, busch, centorr, cha, coil winder, coil winding, cryopump, curve generator, cvc, daymax disperser, dehaart, denton, despatch, diffusion pump, disco, dry box, dynascope, ebara, edwards, eg&g lock-in amplifier, electra, electric furnace, elgin, engis, environmental chamber, equipe technologies, eubanks, exfo acticure, freeze fracture etch, glass blowing lathe, glove box, glovebox, gorman coil winder, grieve, haake, high vacuum blower, high vacuum equipment, hotpack, hughes welder, humidity chamber, hyprez, inficon, instron tensile tester, intertest, ion pump, ipsen, karl suss, kinney, labconco, labline, lauda, leak detector, leco, leesona, leica, leybold, lindberg, litton, loh, lucifer furnace, mantis, mass flow controller, mcpherson monochrometer, md tuthill, mech-el, metalurgical polisher, metalurgical test, metaphot, meteor coil, meyer-burger, micro automation, micro hardness, microhardness, mill lane, mks, monochrometer, mpm screen printer, mrc, napco, neslab, newport optical table, nikon microscope, nikon stereo, nord, nrc, nrc optical table, olympus, optical comparator, optical grinding machinery, optiphot, oriel, par lock-in amplifier, perkin elmer, presco, profilometer, ransco, raytheon welder, rebuilt, reconditioned, refrigerated bath, residual gas analyzer, rogers & clarke, roots blower, saunders & assoc, screen printer, scroll pump, sharp instruments, shimadzu, shuron, sloan, sloan dektak, spindle polisher, spitfire, staco, stereo microscope, stereozoom, stevens coil, stokes, strasbaugh, struers, technics, temescal, tempress, tenney, thermolyne, thermotron, tinius olsen charpy izod, toolmakers microscope, trio tech, trio-tech, turbo pump, tylan mass, udagawa, uhv system, ultra high vacuum, ulvac, unitek, unitek welder, unitron, used, used electric oven, used optical polishing, used vacuum equipment, vacuum atmospheres, vacuum furnace, vacuum monochrometer, vacuum oven, varia, varian, veeco, vision engineering, vitronics, vrc, wafer dicing, wafer saw, water bath, water chiller, water recirculator, welch, western magnum, zeiss
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Elume Inc.
: : ELume Microchip Foundry and Wafer Processing Facilities : :
Microchip Foundry fabrication process solutions and large wafer processing
aluminum lift off, amorphous (alpha) semiconductor processes, dielectric thin films, floating thin films, gdsii file generation, gold, hd hitachi-dupont polyimides spin-coating photo-re, koh etching, lithography mask design, modeling and simulation, n type solid-liquid phosphorous liquid-soli source, oxidation thermal-lto, oxy-nitride processes, p(l)zt sol-gel thin films, photolithography one micron and larger, plasma etching rie silicon glass, platinum, silicon nitride deposition, sodium chloride substrates processes, sol-gel liquid metal, sol-gel processing, spin coating, spin coating introduction, tantalum oxide resistive-capacitive thin films, thin-film sputtering-evaporation, titanium oxide, transparent conductor films, tungsten pecvd, vacuum metalization, wafer and die probing, wafer dicing, wafer fabrication silicon-glass-ceramic-lithium ni, wafer processing silicon-glass-ceramic-lithium nio
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Corwil Technology Corp.
CORWIL | Welcome to CORWIL
Corwil Technology Corporation - Quality IC Assembly Services.
bga, ceramic packages, cerdips, cerquads, chip-on-board, cob, customer samples, dscc suitability letter, engineering builds, fine pitch bonding, heat sink studs, ic assembly, iso-9002, jlcc, lcc, mcm, method 5004/5005, mil-spec, mil-std-883 certified, multi-chip modules, open cavity plastic, package, pin-down configurations, pin-up configurations, plastic assembly, prototype assembly, qml listed, quad flatpacks, quick-turn prototypes, sidebraze, soic, wafer, wafer dicing
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Wadsworth-Pacific Home Page
Wadsworth-Pacific is a pioneer representative firm specializing in leading-edge materials for semiconductor fab, assembly and packaging. LTCC, stamped and etched leadframes, BGA heat spreaders and stiffeners, plastic shipping rails and leadframe packaging, UV dicing and backgrinding tape, diamond backgrinding wheels
alivh, altic, any layer invisible via hole, atlantic diamond, back end, backend, backgrinding, bga, bga stiffeners, chip scale packaging, copper leadframes, csp, diamond backgrinding wheels, diamond wheels, dicing wheels, dual gauge, etched leadframes, final manufacturing, furukawa, heatspreaders, hirai seimitsu, interleafs, interleaves, laminates, lead frame, leadframe boxes, leadframes, low temperature co-fired ceramic, ltcc, mask cases, micro-vias, microvias, pbga, pdi, plastic development, semi, semiconductor assembly, semiconductor backend, semiconductor packaging, semiconductor packaging and assembly, shipping rails, sip, system in package, tape and reel, thermal packaging, thinning, to-220, tubes, uv tape, via hole, vinyl packaging, wafer dicing, wafer scale, wafer thinning
