underfill
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Nordson Plasma Systems
March Plasma Systems - Plasma technology for semiconductor, wafer level packaging, PCB and medical device industries +1-925-827-1240
The global leader in gas plasma technology for Semiconductor, Wafer Level Packaging, Printed Circuit Board and Life Science industries. We design and manufacture a complete line of plasma treatment systems, and maintain an expert staff of scientists and engineers trained in plasma science for advanced packaging, life science and PCB technology.
150 mm, 200 mm, 300 mm, bga, depostion, descum, desmear, etch, etch back, flip chip, medical, pcb, plasma, plasma treatment, printed circuit board, semiconductor, treatment, underfill, wafer
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Creative Automation Co.
Creative Automation Company
Design and build cost effective and innovative solutions to manufacturing requirements -- equipment developed in partnership with customers, applying proven leading edge technology.
adhesive, adhesives, archimede, automated, automatic, benchtop, bonding, computer controlled, computerized, contouring, custom, cyanoacrylate, dam, dam & fill, dam and fill, dispenser, dispensing, encapsulant, encapsulation, epoxy, fluid, glob-top, high viscosity, in-line, in-place gasket, in-place gasketing, industrial fluid dispensing, ink, inline, lubricant, material, modular, piston, positive displacement, programmable, pump, reagent, rotary screw, rtv, silicone, solder mask, solder paste, special, thin, underfill, uv, uv cureable, watery
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Power Devices Inc. Div., Henkel Loctite Corp.
Loctite Phase Change TIM, Henkel, Heat Dissipation, High Performance Thermal Interface Products, Powerstrate, Thermstrate, Isostrate, Powerfilm, Silverstrate, Emi-Strate
Loctite Phase Change TIM, High Performance Thermal Interface Products, Powerstrate, Thermstrate, Isostrate, Powerfilm, Silverstrate, Emi-Strate
3m, ac switch, ac-ac, ac-dc, adhesive, al 1145, aluminum foil, amd processor, amp, anti-static, arc, artic silver, asipm, assembly, astm, automation, b2b, b2c, battery systems, bergquist, block testing, board level, business to business, business to consumer, chemical, chomerics, cisco, clamping pressure, coating, components, contract manufacturing, converting, copper foil, cost-savings, device cooling, device footprint, device reliability, devices, die stamping, diode, distribution, dupont, easy release films, electrical insulation, electronics, electronics cooling, electronics overheating, emi-shielding, emi-strate, epoxy, fabrication, film, film cutting, flux, foams, foil, foil cutting, full brick, gap pad, general electric, grease replacement, grease substitute, half brick, heat flux, heat sink, heat sink clips, heat sink cooling, heat sink extrusion, heat sink fans, heat transfer, heat-dissipation, heat-generating component, henkel, hi-pot testing, high-performance, igbt, industrial, intel, interface, interface solutions, international rectifier, inventory management, ipm, ir, iso 9000, iso 9000:2001, isostrate j-series, ito-220, just-in-time, kanban, kapton, kiss cutting, label printing, laser cutting, lidded processor, liners, liquid cooled, loctite, log rolls, logistics, low-cost thermal materials, magnet wire insulation, manufacturing, manufacturing solutions, manufacturing technology, material thickness, mcm-strate, medical, medical device applications, melting point, microprocessor, military applications, mosfets, motor controls, motor drives, mrp, mylar, nano materials, oem, oem applications, off-shore manufacturing, operating temperature, orcus, original equipment manufacturer, paper, pcb, pentium processor, phase-change, polyester, power assemblies, power control, power devices, power module, power supplies, power supply, powerex, powerfilm, powerfilm tc, powerstrate extreme, powerstrate xtreme, pre-applied, pre-formed materials, pressing, printed circuit boards, private labeling, prototyping, quarter brick, radio assemblies, rectifier, reflow, release, rf devices, rotary converting, rubber, schottky, scr, screen coating, semiconductor, shinetsu, short lead-time, silicone controlled rectifier, silicones, silstrate, silstrate 1.4, silverstrate, solder, solid state relay, speaker assemblies, spray-on, stainless steele, steel rule dies, steel rule tools, sun, surface conditions, surface flatness, surface voids, tapes, teflon, thermagon, thermal adhesive, thermal analysis, thermal automotive, thermal chemicals, thermal circuits, thermal coating, thermal compound, thermal conductivity, thermal consulting, thermal contact, thermal controllers, thermal cooling, thermal cycling, thermal dispensing, thermal equipment, thermal expansion, thermal fluids, thermal grease, thermal impedance, thermal induction, thermal insulation, thermal interface dispensing, thermal interface material, thermal lighting, thermal management, thermal memory, thermal modeling, thermal particles, thermal pressure, thermal printing, thermal problems, thermal recommendation, thermal screen printing, thermal sensors, thermal software, thermal solutions, thermal technologies, thermal technology, thermal testing, thermal transmission properties, thermstick, thermstrate tc, thru-cutting, thyristor, tim, tim 1, tim 2, tim dispensing, to-218, to-220, to-247, to-262, transitor, transport, transporting, trucking, ultem, underfill, valox, value added formulation, value added materials, value added mixing, value added packaging, value added services, value added warehousing, vertical component mounting, volt
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Protavic America, Inc.
Protavic America Inc. An Affiliate Company of Protex International Group - USA
Adhesives, Sealants, Coatings; Encapsulants. Utilizing Thermoset Resin Technologyfor Computers & Disk Drives, Electronic Devices, Military Equipment, Microwave Devices, Hybrid Circuits,Power Supplies & Circuit Boards. Encapsulation & Imbedment for electronic components & assemblies.
adhesives, antenna inks, anti-static compounds, anti-static encapsulants, anti-static sealants, automotive adhesives, bga materials, capacitors, casting resin, chip bonding, cob materials, coil impregnants, conductive paths, conformal coatings, dam & fill, dam and fill, die attach, electrically conductive adhesives, electrically insulating adhesives, electrically insulating sealants, electronic adhesives, electronic compound, emi shielding, encapsulants, encapsulation compound, encapsulation resin, epoxy adhesives, epoxy encapsulants, ferrite, ferrite core adhesives, flexible adhesives, flexible encapsulants, flexible sealants, furniture adhesive, glob top, golf club adhesives, guartz filter, heat sink adhesives, high voltage encapsulants, hybrid circuits, impregnating compounds, industrial adhesives, insulating compounds, lead free, lid attach adhesives, magnetics, materials for die attach, materials for integrated circuits, materials for smart cards, mcm materials, membrane, membrane switch inks, molding compounds, optical bonding, optical coatings, plastic adhesive, polyurethane, polyurethane encapsulants, potting compound, power supply, power supply encapsulants, quartz bonding, quartz filter adhesives, resistor materials, rf tags, rfi shielding, sealants, shielding, silicone encapsulants, silicones, silver adhesive, silver coatings, silver flake, silver ink, silver paint, silver powder, smart card, smartcard, solder replacement, strain gauge bonding, structural adhesives, tantalum capacitors, thermally conductive adhesives, transformer encapsulants, ul recognized adhesives and sealants, underfill, underwriters lab, uv curable coatings & adhesives, wood adhesive
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Speedline Technologies-camalotSpeedline Technologies - ACCEL, CAMALOT, MPM, and ELECTROVERT
Speedline brands include: ACCEL, CAMALOT, MPM, and ELECTROVERT
accel, camalot, dispensing systems, electrovert, lead free wave solder, mems manufacturing, mpm, reflow oven, semiconductor manufacturing, speedline technologies, stencil printers, underfill, wafer bumping
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Asymtek, A Nordson Co.
Asymtek Automated Fluid Dispensing Equipment
Asymtek designs and manufactures a full line of automated fluid dispensing equipment for electronics, semiconductor, packaging, coating, industrial, and surface mount assembly.
acp dispensing, adhesive dispensing, anisotropic conductive paste, auger pumps, automated fluid dispensers, bonding, cavity fill, chip encapsulation, chip scale packaging, conductive adhesives, conductive epoxy, conformal coating, conformal coating dispensing, dam & fill, dam and fill, die attach, dispensejet, dispenser, dispensing system, encapsulation, flat panel display, fluid dispenser, fluid dispensers, flux jetting, fpd, gasketing, high speed dispensing, jet, jetting, lid seal, life science, life sciences, medical electronics, micro dot, micro-dot, precision dispenser, printed electronics, rfid, rfid antenna, rfid tags, sealing, selective flux jetting, semiconductor, sma, solder mask, solder paste, surface mount adhesive dispensing, thermal compounds, underfill, underfill dispenser
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March Instrument, Inc.
March Plasma Systems - Plasma technology for semiconductor, wafer level packaging, PCB and medical device industries +1-925-827-1240
The global leader in gas plasma technology for Semiconductor, Wafer Level Packaging, Printed Circuit Board and Life Science industries. We design and manufacture a complete line of plasma treatment systems, and maintain an expert staff of scientists and engineers trained in plasma science for advanced packaging, life science and PCB technology.
150 mm, 200 mm, 300 mm, bga, depostion, descum, desmear, etch, etch back, flip chip, medical, pcb, plasma, plasma treatment, printed circuit board, semiconductor, treatment, underfill, wafer
