metalization
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Delaware Diamond Knives
With extensive diamond tool, product and services experience, DDK makes precise cutting tools, diamond parts and services for a variety of industries including microtomy, histolgy, and the semiconductor and fiber optic industries.
tungsten carbide, natural diamond, cleave tools, cvd diamond, cvd film, ddk, delaware diamond knives, diamond knives, diamond parts, diamond scalpels, diamond scoring tools, diamond wire saws, disposable steel knives, fiber optic cleavers, gallium arsenide scribing, germanium scribing, grinding and polishing, histo knives, iii/iv naturals cutting, indium phosphide scribing, laser sawing, metalization, pen scoring tools, precise edges, sapphire knives, scribe and break, si substrate removal, silicon scribing, vacuum brazing
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International Sensor Systems, Inc.
Custom Electronic Design and Manufacturing - ISSI provides custom electronic design and manufacturing for a variety of industries, the U.S. military, and OEMs. International Sensor Systems offers five technologies - Multichip Module, Thick Film Hybrid, Ch
ISSI provides custom electronic design and manufacturing for a variety of industries, the U.S. military, and OEMs. International Sensor Systems offers five technologies - Multichip Module, Thick Film Hybrid, Chip-on-Board, Surface Mount, and Through-Hole.
electronic, cad, ceramic, screen, laminate, test, hybrid, assembly, die, layout, prototype, circuit, trimming, pcb, chip, contract manufacturing, turnkey, high tech, quality control, semiconductor, quality assurance, sip, wave, ansi, inspect, process control, smt, surface mount, computer aided design, module, conductive, solder, interconnect, high-tech, output, printed circuit board, kevlar, pitch, polymers, capacitor, ic, circuit design, custom manufacturing, dip, qa, firing, ipc, resistor, multilayer, sot, pick and place, pwb, substrate, through-hole, input, integrated circuit, qc, alumina, electrical test, reflow, through hole, burn-in, multi-layer, thick, circuit assembly, conductors, pth, tcr, wave solder, conformal coat, eutectic, flip chip, mcm, mil-std, qfp, tsop, chip on board, chip-on-board, cob, custom electronic design, custom package, flex circuit, plcc, polymide, proto-type, thick film, wire bonding, abrasive trim, aluminum nitride, association connecting electronics industries, automatic placement, ball bonding, beryllia, cermet, co-fired, custom electronic, die bond, dielectrics, dual in-line package, dual inline package, dual-in-line-package, environmental test, fine pitch, handsolder, high density interconnect, laser trim, metalization, military standards, miniaturization, multichip, multichip module, palladium silver, plastic leaded chip carrier, plated through-hole, platinum gold, platinum silver, printed through hole, printed wire board, quad flat pack, single in-line package, single-in-line-package, single-inline-package, small outline integrated circuit, small outline package, soic, temperature coefficient resistance, thick film hybrid, thick film inks, thick film pastes, thin small outline package, thin small-outline package, tsot, wave-solder, wedge bonding
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Stellar Industries Corp.
Stellar Industries: Thermal Management Specialists
Stellar Industries Corp. sells to the Telecom, Biomedical, and Defense Industries for custom products and services. Stellar?s products include custom lapped and polished electronic grade ceramics composed of Alumina, Beryllium Oxide, Aluminum Nitride, or specialty ceramics. Stellar also supplies custom services for metalizations on these ceramics using a variety of thick film, thin film, refractory and Direct Bond Copper metalizations.
clean room, brazing, ti, diode, pvd, dbc, substrates, thin film, cuw, high power laser diode, thick film, ceramic machining, copper-tungsten replacement, dcb, direct bond copper, direct copper bond, electroformed copper, jet process, metalization, p-side down mounting, sn, stellar industries, submount
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Diemat, Inc.Diemat, Inc. | The Leader in Thermally Conductive Adhesives and Low-Temperature Sealing Glasses
The Leader in Thermally Conductive Adhesives and Low-Temperature Sealing Glasses
fiber optic, adhesive, glue, component, sealant, semiconductors, heat transfer, solder, soldering, curing, induction, fiberoptic, firing, thermoset, hermetic, lead free, microelectronics, thermal management, heat sinks, thermal engineering, die attach, feedthrough, kovar, melting, thermals, ag epoxy, ag-filled epoxy, b stage, b staged, b-stage, b-staged, die bonding, die-attach, diemat, dm2700, dm2700pf, dm3030, dm4030ht, dm4030ld, dm4030sm, dm4130ht, dm4130sm, dm4131ht, dm5030p, dm5130p, dm6030hk, dm6030hk-pt, dm6030hk-sd, dm6030sf, flux-free solder glass, fluxless preform, fluxless solder, gold-plated, lead-free, low temperature glass, low-temperature glass, metalization, metallization, pb free, pb-free, pin transfer, silver epoxy, silver-filled epoxy, solder glass, solder glass preforms, solder replacement, thermal adhesive, thermal conductor, thermal consulting, thermal design and analysis, thermal epoxy, thermal problems, thermalloy, thermoplasticthermal solutions, thermosetting
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Radiant Technology Corp.
Welcome to BTU International - The Global Leader in Thermal Technology
BTU International - Thermal expertise for electronics and materials processing
radiant heat, argon, engineering services, semiconductor, ir, capacitors, continuous, atmosphere, surface mount, hydrogen, drying, heat treating, soldering, brazing, dca, resistors, kilns, batch, curing, bga, wafer, smd, pcb assembly, thermocouples, mems, annealing, flex circuits, fuel cells, reflow, surface mount technology, convection, lead free, solar cells, bme, refractories, surface mount assembly, bright annealing, eutectic, flip chip, mcm, capacitor arrays, chip scale, chip scale packaging, closed loop control, die attach, ltcc, oxidizing, sintering, smta, surface mount device, thick film, wafer bumping, wlp, aluminum brazing, atmosphere safety systems, binder burnout, calcining, capacitor firing, carbonizing, center board support, ceramic co-firing, chip attach, chip joining, chip size packaging, continuous belt furnaces, continuous belt ovens, controlled atmosphere brazing, convection drying, copper bonding, copper brazing, copper termination firing, copper thick film, cusil brazing, debinder, direct bond copper, electronics brazing, epoxy curing, flux free soldering, flux management, fuel cell processing, gadolinium processing, gas separation barrier sinteirng, glass passivation, glass to metal sealing, high lead, high temperature sintering, hydrogen cleaning, ir drying, light metal sintering, low temperature cofired ceramics, metal and ceramic sintering, metalization, microelectronics packaging, mlcc, multi-layer ceramics, nickel brazing, nitrogen atmosphere, nuclear fuel, nuclear fuel pellet sintering, nuclear fuel sintering, opto- electronics reflow, photronics component reflow, polymer reflow, polymer thick film, powder metal sintering, precision resistor firing, pusher furnaces, pusher kilns, silver firing, sinter, solder bump, solder reflow, solid oxide fuel cell sintering, surface mount reflow, termination firing, thermal processing, uranium processing, void free soldering, wafer bump reflow, walking beam furnaces
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Cha IndustriesCHA Industries Evaporation and sputtering system for semiconductor, optical and precision coating applications
Manufacturing evaporation and sputtering high vacuum deposition systems. CHA Industries manufactures LED optical systems and electron beam guns. Makes vacuum deposition systems for use in electron microscopy, precision optics, research, production & ophthalmic applications.
sputtering, mems, microscopy, evaporation, r & d, metallic coatings, vacuum chamber, eb, electron beam gun, high vacuum, optical coatings, thin film coatings, vacuum coating, vacuum engineering, cha industries, deposition systems, dielectric coatings, ion assisted deposition, loadlock, metalization, metallization, mirror coatings, nano technology, pecvd, sem sample preparation, thermal evaporation, thin film consulting, uhv, vacuum deposition, vacuum deposition systems
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Seleco Inc.
S E L E C O inc. the premeir provider for EMI/RFI Shielding
Seleco, Inc. is the premier provider of selective conductive coating solutions to EMI/RFI Shielding and Electrostatic Discharge Protection needs.
pad, magnesium, emi, conductive, sonic, rfi, shielding, emi shielding, light assembly, selective, chromating, insertion, conductive coatings, emi/rfi, selective plating, sheilding, assembly work, metalization, selective metalization
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Btu Engineering Corp.
Welcome to BTU International - The Global Leader in Thermal Technology
BTU International - Thermal expertise for electronics and materials processing
radiant heat, argon, engineering services, semiconductor, ir, capacitors, continuous, atmosphere, surface mount, hydrogen, drying, heat treating, soldering, brazing, dca, resistors, kilns, batch, curing, bga, wafer, smd, pcb assembly, thermocouples, mems, annealing, flex circuits, fuel cells, reflow, surface mount technology, convection, lead free, solar cells, bme, refractories, surface mount assembly, bright annealing, eutectic, flip chip, mcm, capacitor arrays, chip scale, chip scale packaging, closed loop control, die attach, ltcc, oxidizing, sintering, smta, surface mount device, thick film, wafer bumping, wlp, aluminum brazing, atmosphere safety systems, binder burnout, calcining, capacitor firing, carbonizing, center board support, ceramic co-firing, chip attach, chip joining, chip size packaging, continuous belt furnaces, continuous belt ovens, controlled atmosphere brazing, convection drying, copper bonding, copper brazing, copper termination firing, copper thick film, cusil brazing, debinder, direct bond copper, electronics brazing, epoxy curing, flux free soldering, flux management, fuel cell processing, gadolinium processing, gas separation barrier sinteirng, glass passivation, glass to metal sealing, high lead, high temperature sintering, hydrogen cleaning, ir drying, light metal sintering, low temperature cofired ceramics, metal and ceramic sintering, metalization, microelectronics packaging, mlcc, multi-layer ceramics, nickel brazing, nitrogen atmosphere, nuclear fuel, nuclear fuel pellet sintering, nuclear fuel sintering, opto- electronics reflow, photronics component reflow, polymer reflow, polymer thick film, powder metal sintering, precision resistor firing, pusher furnaces, pusher kilns, silver firing, sinter, solder bump, solder reflow, solid oxide fuel cell sintering, surface mount reflow, termination firing, thermal processing, uranium processing, void free soldering, wafer bump reflow, walking beam furnaces
