backgrinding
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Valley Design Corp.
Lapping, optical polishing and dicing services
Polishing, lapping, dicing, backgrinding are some of the capabilities of the world
backgrinding, ceramics dicing, ceramics thinning, cmp, cmp polishing, dicing, edge polishing, lapping, lapping substrates, optical polishing, polished substrates, polishing, wafer dicing
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Wadsworth-pacific
Wadsworth-Pacific Home Page
Wadsworth-Pacific is a pioneer representative firm specializing in leading-edge materials for semiconductor fab, assembly and packaging. LTCC, stamped and etched leadframes, BGA heat spreaders and stiffeners, plastic shipping rails and leadframe packaging, UV dicing and backgrinding tape, diamond backgrinding wheels
alivh, altic, any layer invisible via hole, atlantic diamond, back end, backend, backgrinding, bga, bga stiffeners, chip scale packaging, copper leadframes, csp, diamond backgrinding wheels, diamond wheels, dicing wheels, dual gauge, etched leadframes, final manufacturing, furukawa, heatspreaders, hirai seimitsu, interleafs, interleaves, laminates, lead frame, leadframe boxes, leadframes, low temperature co-fired ceramic, ltcc, mask cases, micro-vias, microvias, pbga, pdi, plastic development, semi, semiconductor assembly, semiconductor backend, semiconductor packaging, semiconductor packaging and assembly, shipping rails, sip, system in package, tape and reel, thermal packaging, thinning, to-220, tubes, uv tape, via hole, vinyl packaging, wafer dicing, wafer scale, wafer thinning
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Silicon Quest International
Silicon Quest International - Silicon Wafers and Wafer Processing Services
Full service supplier of silicon wafers and wafer processing services, including polishing, reclaim, thermal oxide and back-grinding. Supplies silicon wafers in all specifications from 2in. to 300mm in diameter.
100mm wafers, 12 inch wafers, 125mm wafers, 150mm wafers, 2 inch wafers, 200mm wafers, 3 inch wafers, 300mm wafers, 4 inch wafers, 5 inch wafers, 6 inch wafers, 8 inch wafers, as cut wafer, backgrind, backgrinding, backlap, backlapping, coin roll, custom processing, etched wafer, grind and polish, grinding, lapping, laser cut down service, laserscribe, oxide, oxide facility, polished silicon wafer, prime grade wafer, reclaim, semiconductor materials, semiconductor wafer, silicon, silicon carbide wafer, silicon on insulator, silicon quest, silicon quest international, silicon wafer, silicon wafer chip, silicon wafer dicing, silicon wafer distributor, silicon wafer manufacturing, silicon wafer processing, silicon wafer supplier, silicon wafers, silicon-on-insulator, soi, soi wafers, test grade wafer, thermal oxide, thermal oxide service, thin film service, wafer, wafer cleaning, wafer cut-down, wafer fab, wafer polishing, wafer processing service, wafer thinning, world wide silicon distributor
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Wadsworth-Pacific Home Page
Wadsworth-Pacific is a pioneer representative firm specializing in leading-edge materials for semiconductor fab, assembly and packaging. LTCC, stamped and etched leadframes, BGA heat spreaders and stiffeners, plastic shipping rails and leadframe packaging, UV dicing and backgrinding tape, diamond backgrinding wheels
alivh, altic, any layer invisible via hole, atlantic diamond, back end, backend, backgrinding, bga, bga stiffeners, chip scale packaging, copper leadframes, csp, diamond backgrinding wheels, diamond wheels, dicing wheels, dual gauge, etched leadframes, final manufacturing, furukawa, heatspreaders, hirai seimitsu, interleafs, interleaves, laminates, lead frame, leadframe boxes, leadframes, low temperature co-fired ceramic, ltcc, mask cases, micro-vias, microvias, pbga, pdi, plastic development, semi, semiconductor assembly, semiconductor backend, semiconductor packaging, semiconductor packaging and assembly, shipping rails, sip, system in package, tape and reel, thermal packaging, thinning, to-220, tubes, uv tape, via hole, vinyl packaging, wafer dicing, wafer scale, wafer thinning
