alivh
-
Wadsworth-pacific
Wadsworth-Pacific Home Page
Wadsworth-Pacific is a pioneer representative firm specializing in leading-edge materials for semiconductor fab, assembly and packaging. LTCC, stamped and etched leadframes, BGA heat spreaders and stiffeners, plastic shipping rails and leadframe packaging, UV dicing and backgrinding tape, diamond backgrinding wheels
pdi, backend, tape and reel, back end, diamond wheels, furukawa, lead frame, semiconductor packaging, alivh, altic, any layer invisible via hole, atlantic diamond, backgrinding, bga stiffeners, chip scale packaging, copper leadframes, diamond backgrinding wheels, dicing wheels, dual gauge, etched leadframes, final manufacturing, heatspreaders, hirai seimitsu, interleafs, interleaves, leadframe boxes, leadframes, low temperature co-fired ceramic, ltcc, mask cases, micro-vias, microvias, pbga, plastic development, semiconductor assembly, semiconductor backend, semiconductor packaging and assembly, shipping rails, system in package, thermal packaging, to-220, uv tape, via hole, vinyl packaging, wafer dicing, wafer scale, wafer thinning
-
Wadsworth-Pacific Home Page
Wadsworth-Pacific is a pioneer representative firm specializing in leading-edge materials for semiconductor fab, assembly and packaging. LTCC, stamped and etched leadframes, BGA heat spreaders and stiffeners, plastic shipping rails and leadframe packaging, UV dicing and backgrinding tape, diamond backgrinding wheels
pdi, backend, tape and reel, back end, diamond wheels, furukawa, lead frame, semiconductor packaging, alivh, altic, any layer invisible via hole, atlantic diamond, backgrinding, bga stiffeners, chip scale packaging, copper leadframes, diamond backgrinding wheels, dicing wheels, dual gauge, etched leadframes, final manufacturing, heatspreaders, hirai seimitsu, interleafs, interleaves, leadframe boxes, leadframes, low temperature co-fired ceramic, ltcc, mask cases, micro-vias, microvias, pbga, plastic development, semiconductor assembly, semiconductor backend, semiconductor packaging and assembly, shipping rails, system in package, thermal packaging, to-220, uv tape, via hole, vinyl packaging, wafer dicing, wafer scale, wafer thinning
