advanced microelectronics
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Metal Matrix Cast Composites, Inc.
Metal Matrix Cast Composites
Engineered metal matrix composites for reserch, industry and defense.
light weight, aluminum casting, alumina, cte, heatsink, thermal management, heat sinks, mmc, power modules, thermal conductivity, al2o3, aln, cuw, electronics thermal management, heat sink, igbt, kovar, microelectronic packaging, thermal solutions, advanced microelectronics, al/gr, al/sic, alsic, aluminum graphite, aluminum silicon carbide, baseplates, ce alloys, composite alloys, controlled expansion, copper graphite, copper molybdenum, copper tungsten, cu/gr, cumo, electronic packages, electronics cooling, flip chips, flipchips, gr/al, gr/cu, graphite aluminum, graphite fiber composites, high thermal, igbt base plate, igbt baseplates, igbt thermal management, low cte, matched cte, metal matrix composites, metgraf, metsic, microprocessor lids, microprocessor thermal management, near net shape, net shape, power substrates, precision aluminum casting, silvar, thermal management materials
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Ceramics Process Systems
CPS - AlSiC materials for electronic thermal management and packaging solutions
Ceramics Process Systems Home Page is the world
ametek, aluminum casting, asic, cte, heatsink, lec, lockheed, thermal management, heat sinks, thermal engineering, thermal conductivity, cuw, electronics thermal management, heat sink, igbt, kovar, thermal solutions, advanced microelectronics, al/sic, alsic, aluminum silicon carbide, amc composites, baseplates, ceramics process systems, cooling magazine, copper molybdenum, copper tungsten, cumo, electronic packages, electronics cooling, electrovac, flip chips, flipchips, igbt base plate, igbt baseplates, igbt thermal management, ixion, lanxide, light weight alsic, matched cte, metal matrix composite, microprocessor lids, microprocessor thermal management, microwave journal, nextel fiber composites, polese, power substrates, precision aluminum casting, silvar, thermal managment materials
