ikm2: bare die
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Gel-pak, Llc
Gel-Pak: Home Page
Gel-Pak products prevent device damage that can result from contact with the edges or top surface of the carrier. Using surface tension, components are held in place and protected, even if the carrier is tilted, jarred, or turned upside down, yet they can still be easily removed. Gel-Pak products provide significantly more device protection than a traditional waffle pack or chip tray and eliminate the need for pockets or cavities. All of the products can be customized by optimizing the Gel retention level (the tack or adherence of the Gel) based on the size, weight and surface finish of the customer
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Rd AutomationWelcome to Laurier Incorporated - Manufacturer of Die Sorting and Tray Handling equipment.
Laurier Inc. of Londonderry, NH has built the largest installed base of semi-automatic and fully automated die sorting systems in the world. Laurier also manufactures high precision flip chip die bonders and stacked tray feeders for automated handling of Waffle packs and JEDEC trays.
pick and place, reflow, optoelectronics, tape and reel, adhesive bonding, flip chip, indium, focal plane array, known good die, laser bonding, laurier, 1 micron bonding, automatic bonder, bare die, detector bonding, die binning, die in tape reel, die pick and place, die plating, die sort, die sorting, die to tape reel, die to wafer bonding, die trays, eutectic bonding, flip chip bond, flip chip bonder, flip chip die bonder, flip chip sorting, gelpak, gold tin bonding, high force bonder, led sorting, manual bonder, precision bonding, precision die attach, precision flip chip bonder, split prism camera, thermocompression bonding, vcsel bonding, wafer sorting, wafer to wafer bonding, waffle pack, wlcsp sorting
